Vol.8, No.3, August 2019.                                                                                                                                                                                ISSN: 2217-8309

                                                                                                                                                                                                                        eISSN: 2217-8333


TEM Journal



Association for Information Communication Technology Education and Science

Connecting Copper Wire to Thin Metal Layers


Paštéka Michael, Králik Marian, Hladiš Peter


© 2019 Králik Marian, published by UIKTEN. This work is licensed under the Creative Commons Attribution-NonCommercial-NoDerivatives 4.0 License. (CC BY-NC-ND 4.0)


Citation Information: TEM Journal. Volume 8, Issue 3, Pages 728-732, ISSN 2217-8309, DOI: 10.18421/TEM83-05, August 2019.


Received: 17 May 2019.

Revised:   29 July 2019.
Accepted:  02 August 2019.
Published: 28 August 2019.




The process or a system of creating connection between two electrical conductive materials is referred to as heat bonding. In this case it is correct to call it micro bonding. Essential characteristics of this process are pressing two materials together and applying heat. Similar processes are used to create connections to LCDs (Liquid crystal displays) or PCB. This paper discusses copper wire bonding technology to a thin metal layer made on dielectric sheet for micro coils.


Keywords – electrical bond, connecting, thin metal layers, weld, pressure.



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